The effect of immersion time in a benzotriazole solution on anodic behaviour of AgCu50 alloy

Abstract

Electrochemical behavior of silver ,copper and AgCu50 alloy after their immersion in 0.01 mol/dm3 benzotriazole solution for 30, 360, 720 i 1440 minutes, was investigated in 0.1 mol/dm3 NaOH using the cyclic voltammetry method. Currents on cyclic voltammograms for both, pure silver, pure copper and AgCu50 alloy recorded after imemersion in the benzotriazole solution are lower than the corresponding currents obtained without the contact of the metals with BTA. During the immersion of electrodes in solution of benzotriazole, a protective film of AgBTA is formed on silver and CuBTA film is formed on copper surface. Increasing in immersion time has a positive effect on silver and copper corrosion resistance in investigated solution.